Job
In this role, you will develop innovative simulation methodologies and design flows in an HPC Linux environment to advance the co-design of chips, packages, and boards while optimizing cluster solutions.
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Job technologies
Your role in the team
- Develop and support simulation methodologies, design flows, and tool environments for Chip-Package-Board (CPB) Co-Design and advanced package development in Linux-based HPC environment.
- Drive and continuously improve methodologies for electromagnetic, thermal and multiphysics analysis supporting semiconductor package and system development.
- Own and maintain the simulation environment within the CPB Co-Design Flow & Methodology team and provide consulting and support to product development projects worldwide.
- Enable simulation-driven design and verification for advanced packaging technologies including System-in-Package (SiP), heterogeneous integration, and 2.5D/3D package solutions.
- Arbeiten Sie eng mit den Geschäftsbereichen, Design Systems, Paketentwicklungsteams und externen Technologiepartnern zusammen, um Simulationsanforderungen zu erfüllen und erstklassige Engineering-Lösungen zu entwickeln.
- Drive technology evaluations, benchmarks, automation initiatives, and knowledge sharing activities to continuously improve simulation capabilities and engineering productivity.
Our expectations of you
Education
- Degree in Electrical Engineering, Microelectronics, Physics, Computational Engineering, Mechanical Engineering, or a related technical discipline.
Qualifications
- Starker Hintergrund in elektromagnetischer, thermischer oder multiphysikalischer Simulation für die Entwicklung von Halbleiterpaketen und -systemen.
- Nachweisliche Erfahrung in der Entwicklung, Optimierung und Implementierung von Simulationsmethoden, Engineering-Workflows und Designumgebungen.
- Solid knowledge of Linux and one or several of the following programming languages: Python, bash, MATLAB, Perl, skill.
- Strong analytical and problem-solving skills combined with excellent communication abilities and a customer-oriented mindset.
- Fluent English skills are required; German language skills are considered an advantage.
Experience
- At least 4 years of professional experience in semiconductor package development, simulation, design methodologies, EDA environments, or related engineering fields.
- Hands-on experience with industry-standard simulation environments such as Synopsys/Ansys, Cadence, Siemens, Keysight, COMSOL, or comparable engineering platforms.
- Experience with development and integration of Machine Learning (ML) and Artificial Intelligence (AI) tools for design or simulation is an advantage.
What we offer
- The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group G. The monthly salary is paid 14 times per year. We offer a higher compensation depending on your expertise and skills.
Benefits
Health, fitness & fun
Work-Life-Integration
Food & drink
Topics you will work on
Job locations
About your employer
Villach, Klagenfurt, Graz, Linz
Infineon Technologies Austria AG, with its headquarters in Villach, is a subsidiary of Infineon Technologies AG. Besides Germany, Austria is the only location where Infineon combines the skills for research and development, manufacturing and global business responsibility.
- English
- Established Company
- Full Remote, Hybrid, Onsite
- Industry, Production · Electronics, Automatization
Employer reviews
- Team culture
- 2.5
- Career growth
- 2.7
- Working conditions
- 4.3
- Engineering
- 3.0
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