Job
- Level
- Senior
- Job Field
- IT, Application, DevOps
- Employment Type
- Full Time
- Contract Type
- Permanent employment
- Location
- Villach
- Working Model
- Hybrid, Onsite
Job Summary
In this role, you will define design methodologies for Chip-Package-Board and drive technical roadmaps. You'll closely collaborate with engineering teams to continuously enhance methodologies and digital solutions.
Job Technologies
Your role in the team
- Define and drive the technical roadmap for Chip-Package-Board (CPB) design methodologies, flows, tools, and digital engineering capabilities.
- Partner closely with Business Lines, Design Centers, and engineering communities to understand current and future product requirements, technology trends, and business challenges.
- Translate Business Line needs into methodology enhancements, design-flow improvements, simulation capabilities, automation concepts, and EDA roadmap requirements.
- Act as the technical bridge between Business Lines, methodology teams, software teams, IT organizations, and EDA vendors.
- Drive continuous improvement of CPB methodologies and engineering workflows to accelerate design convergence, improve design quality, and increase first-pass success.
- Establish scalable, reusable, and sustainable methodology solutions, standards, and governance models across the CPB ecosystem.
- Identify and shape future capabilities required for advanced packaging, heterogeneous integration, System-in-Package (SiP), 3D design methodologies, multi-domain simulation, and AI-assisted engineering workflows.
- Evaluate and influence EDA vendor technologies and industry trends to ensure alignment with Infineon's future business needs.
- Lead AI, automation, data, and digitalization initiatives that deliver measurable engineering and business value.
- Führen Sie die Entwicklung hin zu einer integrierten, datengetriebenen, KI-gestützten und hochautomatisierten CPB-Co-Design-Umgebung an.
- Provide technical leadership, consulting, training, and enablement for global user communities and stakeholders.
- Build strong partnerships across engineering functions and drive adoption of methodology and digital engineering solutions.
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Our expectations of you
Education
- Degree in Electrical Engineering, Microelectronics, Physics, Computer Engineering, or a related technical discipline, with a minimum of 8 years of experience in semiconductor development, design methodologies, EDA environments, package development, design automation, simulation, or related engineering fields.
Qualifications
- Strong understanding of semiconductor product development, including chip, package, board, simulation, and system-level interactions.
- Ability to understand Business Line challenges, technology roadmaps, and future product requirements, and translate them into methodology strategies, flow enhancements, and technical development roadmaps.
- Strong analytical and strategic thinking skills, with the ability to identify future requirements and drive technology evolution beyond day-to-day operational support.
- Good understanding of digitalization, automation, AI-enabled engineering workflows, and data-driven engineering concepts.
- Strong customer-oriented mindset with the ability to balance operational excellence with long-term methodology, technology, and business strategy.
- Proven track record of leading cross-functional initiatives involving Business Lines, methodology teams, software organizations, IT functions, and external partners.
- Excellent communication, stakeholder management, and influencing skills with the ability to align diverse teams around a common technical vision.
- Ability to act as a trusted technical partner for Business Lines, combining deep engineering understanding with strong business awareness and a passion for enabling future product innovation.
- Fluent English skills are required; German language skills are considered a strong advantage.
Experience
- Proven experience in defining, optimizing, and deploying engineering methodologies and design flows.
- Experience working with EDA technologies and vendors (e.g., Cadence, Synopsys, Keysight, Comsol).
- Software development experience is beneficial but not the primary focus of the role.
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What we offer
- The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group H.
- The monthly salary is paid 14 times per annum.
- We offer a higher compensation depending on your expertise and skills.
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Benefits
More net
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- 💰Bonus Commisions
- 💵Bonus Payments
- 👴🏻Company Retirement Provision
- 👷♂️Additional Insurance
Health, Fitness & Fun
Work-Life-Integration
Food & Drink
Topics that you deal with on the job
Job Locations
This is your employer
Infineon Technologies Austria AG
Villach, Klagenfurt, Graz, Linz
Infineon Technologies Austria AG, with its headquarters in Villach, is a subsidiary of Infineon Technologies AG. Besides Germany, Austria is the only location where Infineon combines the skills for research and development, manufacturing and global business responsibility.
Description
- Language
- English
- Company Type
- Established Company
- Working Model
- Full Remote, Hybrid, Onsite
- Industry
- Industry, Production, Electronics, Automatization
Employer reviews
by devworkplaces.com
Total
(3 Reviews)3.0
Workingconditions
4.2Career Growth
2.6Culture
2.5Engineering
2.9
Senior Staff Engineer Chip Package Board CoDesign
- Location
- Villach
- Working Model
- Hybrid, Onsite
- Diversity
- Open for all genders
