Job
- Level
- Senior
- Job Field
- IT, Application, DevOps
- Employment Type
- Full Time
- Contract Type
- Permanent employment
- Location
- Villach
- Working Model
- Hybrid, Onsite
Job Summary
In this role, you will define design methodologies for Chip-Package-Board and drive technical roadmaps. You'll closely collaborate with engineering teams to continuously enhance methodologies and digital solutions.
Job Technologies
Your role in the team
- Define and drive the technical roadmap for Chip-Package-Board (CPB) design methodologies, flows, tools, and digital engineering capabilities.
- Partner closely with Business Lines, Design Centers, and engineering communities to understand current and future product requirements, technology trends, and business challenges.
- Translate Business Line needs into methodology enhancements, design-flow improvements, simulation capabilities, automation concepts, and EDA roadmap requirements.
- Act as the technical bridge between Business Lines, methodology teams, software teams, IT organizations, and EDA vendors.
- Drive continuous improvement of CPB methodologies and engineering workflows to accelerate design convergence, improve design quality, and increase first-pass success.
- Establish scalable, reusable, and sustainable methodology solutions, standards, and governance models across the CPB ecosystem.
- Identify and shape future capabilities required for advanced packaging, heterogeneous integration, System-in-Package (SiP), 3D design methodologies, multi-domain simulation, and AI-assisted engineering workflows.
- Evaluate and influence EDA vendor technologies and industry trends to ensure alignment with Infineon's future business needs.
- Lead AI, automation, data, and digitalization initiatives that deliver measurable engineering and business value.
- Führen Sie die Entwicklung hin zu einer integrierten, datengetriebenen, KI-gestützten und hochautomatisierten CPB-Co-Design-Umgebung an.
- Provide technical leadership, consulting, training, and enablement for global user communities and stakeholders.
- Build strong partnerships across engineering functions and drive adoption of methodology and digital engineering solutions.
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Our expectations of you
Education
- Degree in Electrical Engineering, Microelectronics, Physics, Computer Engineering, or a related technical discipline, with a minimum of 8 years of experience in semiconductor development, design methodologies, EDA environments, package development, design automation, simulation, or related engineering fields.
Qualifications
- Strong understanding of semiconductor product development, including chip, package, board, simulation, and system-level interactions.
- Ability to understand Business Line challenges, technology roadmaps, and future product requirements, and translate them into methodology strategies, flow enhancements, and technical development roadmaps.
- Strong analytical and strategic thinking skills, with the ability to identify future requirements and drive technology evolution beyond day-to-day operational support.
- Good understanding of digitalization, automation, AI-enabled engineering workflows, and data-driven engineering concepts.
- Strong customer-oriented mindset with the ability to balance operational excellence with long-term methodology, technology, and business strategy.
- Proven track record of leading cross-functional initiatives involving Business Lines, methodology teams, software organizations, IT functions, and external partners.
- Excellent communication, stakeholder management, and influencing skills with the ability to align diverse teams around a common technical vision.
- Ability to act as a trusted technical partner for Business Lines, combining deep engineering understanding with strong business awareness and a passion for enabling future product innovation.
- Fluent English skills are required; German language skills are considered a strong advantage.
Experience
- Proven experience in defining, optimizing, and deploying engineering methodologies and design flows.
- Experience working with EDA technologies and vendors (e.g., Cadence, Synopsys, Keysight, Comsol).
- Software development experience is beneficial but not the primary focus of the role.
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What we offer
- The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group H.
- The monthly salary is paid 14 times per annum.
- We offer a higher compensation depending on your expertise and skills.
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Benefits
Higher Take-Home Pay
- 💻Company Notebook for Private Use
- 💰Bonus Commisions
- 💵Bonus Payments
- 👴🏻Company Retirement Provision
- 👷♂️Additional Insurance
Health, Fitness & Fun
Work-Life-Integration
Food & Drink
Topics You Will Work On
Job Locations
About Your Employer
Infineon Technologies Austria AG
Villach, Klagenfurt, Graz, Linz
Infineon Technologies Austria AG, with its headquarters in Villach, is a subsidiary of Infineon Technologies AG. Besides Germany, Austria is the only location where Infineon combines the skills for research and development, manufacturing and global business responsibility.
Description
- Language
- English
- Company Type
- Established Company
- Working Model
- Full Remote, Hybrid, Onsite
- Industry
- Industry, Production, Electronics, Automatization
Employer reviews
by devworkplaces.com
Total
(3 Reviews)3.0
Workingconditions
4.2Career Growth
2.6Culture
2.5Engineering
2.9
Senior Staff Engineer Chip Package Board CoDesign
- Location
- Villach
- Working Model
- Hybrid, Onsite
- Diversity
- Open for all genders
