Job
- Level
- Senior
- Location
- Vasoldsberg
- Working Model
- Hybrid, Onsite
- Job Field
- Software, Embedded
- Employment Type
- Full Time
- Contract Type
- Permanent employment
- Salary
- from 75.000 € gross/month
Job Summary
In this role, you design RF and high-frequency IC layouts for mixed-signal applications while ensuring compliance with electrical, thermal, and manufacturing requirements.
Job Technologies
Your role in the team
- Design and develop RF and high-frequency IC substrate and PCB layouts for sensor, and mixed-signal applications, ensuring compliance with electrical, thermal, and manufacturing requirements.
- Perform RF-aware component placement and transmission line routing, including controlled impedance structures, differential pairs, coplanar waveguides (CPW), microstrip, and stripline implementations.
- Optimize layout for signal integrity (SI), power integrity (PI), and RF performance, minimizing coupling, crosstalk, insertion loss, return loss, and electromagnetic interference (EMI).
- Create and maintain package substrate and PCB layouts using Cadence Allegro Suite (Allegro X, APD), Altium Designer and/or Siemens PADS including design libraries, stack-ups, and constraint management.
- Collaborate with EMC, analog, package, and IC design engineers to support chip-package-board co-design and ensure successful integration of high-frequency circuits and support for simulation activities using SI/PI/EM extraction tools.
- Perform design verification and manufacturability reviews, including DRC/ERC checks, fabrication rule compliance.
- Supplier selection and qualification for PCB and SMT (surface mount technology), including supply chain and assembly support.
Our expectations of you
Education
- Bachelor's or Master's Degree in Electrical Engineering, Microelectronics, Semiconductor Physics, Computer Engineering, or a related field.
Qualifications
- Knowledge of semiconductor processes, analog/mixed-signal design considerations, and ESD/EMC concepts is considered a strong benefit.
- Knowledge of controlled impedance routing, electromagnetic coupling, grounding strategies, shielding concepts, and RF matching networks.
- Good technical English is a must, German is beneficial.
Experience
- Minimum of 6 years experience in Semiconductor/Electronic Industry.
- Strong experience with Cadence Allegro Suite (Allegro X, APD, Package Designer) and/or Altium Designer.
- Experience with Cadence Virtuoso Suite and Physical Verification Tools such as Siemens Calibre/Candence PVS of is highly desirable.
- Experience with IC package substrates, HDI PCB technologies, BGA, wirebond, and flip-chip packaging.
- CMOS IC layout experience is highly desirable, providing valuable expertise in parasitic control, matching techniques, device placement, shielding concepts, and chip-package-board co-design.
What we offer
- We offer competitive salaries and additional benefits based on your performance, experience and qualification.
- The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group G.
- We offer a higher compensation depending on your expertise and skills.
Benefits
Health, Fitness & Fun
Work-Life-Integration
Food & Drink
Higher Take-Home Pay
Topics You Will Work On
Job Locations
About Your Employer
ams AG
We take sensing to the next level by providing a seamless interface between humans and technology. We enable our customers to create highly differentiated products that are smarter, safer, easier to use and more eco-friendly.
Description
- Language
- English
- Company Type
- Established Company
- Working Model
- Hybrid, Onsite
- Industry
- Electronics, Automatization, Trade, Internet, IT, Telecommunication
IC Package/PCB Layout Engineer
- Salary
- from 75.000 € gross/monthEstimated net salary based on the gross salary in the job ad.from 38.277 € net/month
- Location
- Vasoldsberg
- Working Model
- Hybrid, Onsite
- Diversity
- Open for all genders
